The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 1999
Filed:
Jul. 02, 1996
Applicant:
Inventor:
Toshio Kawakami, Kakogawa, JP;
Assignee:
Ricoh Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R / ; H01L / ;
U.S. Cl.
CPC ...
324765 ; 324754 ;
Abstract
A semiconductor device includes a substrate, a semiconductor chip provided on the substrate, a plurality of terminals provided on a first side of the substrate, each electrically connected to the semiconductor chip and a plurality of test pads for performing electrical characteristic tests on the semiconductor chip, each test pad being electrically connected to a respective terminal in one-to-one correspondence.
Kawakami, Toshio. (1999). Bga package semiconductor device and inspection method therefor (U.S. Patent No. 5986460). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5986460
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile