The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 1999

Filed:

Jan. 31, 1997
Applicant:
Inventors:

Kazutoshi Sakakibara, Aichi, JP;

Minoru Kaneko, Aichi, JP;

Kazumasa Asano, Ibaraki, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K / ; C09K / ; C04B / ;
U.S. Cl.
CPC ...
523459 ; 25238952 ; 106 1405 ; 428328 ; 524439 ;
Abstract

A corrosion preventive material contains zinc and is applied to the surface of a metal product for preventing corrosion of the product. The material consists essentially of a base material of synthetic resin and 65% or more zinc powder by weight dispersed in the base material, the zinc powder containing 25% or more zinc powder by weight having a grain diameter of or above 150 .mu.m. Alternatively, the corrosion preventive material consists essentially of a base material of synthetic resin and 45% or more zinc powder by weight dispersed in the base material, the zinc powder containing 90% or more zinc powder by weight having a grain diameter of or above 150 .mu.m. A method of corrosion prevention includes the steps of bonding a first metal product to a second metal product with an adhesive corrosion preventive material consisting essentially of a mixture of metal powder for sacrificial corrosion prevention which is baser in a galvanic series than the first metal product and an adhesive resin, and applying an electrodeposition coating to surfaces of the first metal product and the adhesive corrosion preventive material subsequently to the bonding step.


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