The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 1999
Filed:
Dec. 07, 1995
Kazuhide Koyama, Kanagawa, JP;
Sony Corporation, , JP;
Abstract
A process for fabricating interconnection of a semiconductor device is provided which allows the physical vapor deposition and reflow treatment to be performed in different apparatuses and requires no surface treatment prior to the reflow treatment. The process comprises the steps of forming a metallic interconnection material layer on a substrate by means of physical vapor deposition using a metallic interconnection material; forming an oxidation preventive film on the metallic interconnection material layer; subjecting the metallic interconnection material layer to reflow treatment to form a complete solid solution of the components constituting the oxidation preventive film with those of the metallic interconnection material layer; and patterning the metallic interconnection material layer to form an interconnection.