The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 1999

Filed:

May. 06, 1996
Applicant:
Inventors:

Ken W Chaney, Palo Alto, CA (US);

Charles Ingalz, San Jose, CA (US);

Assignee:

Sun Microsystems, Inc., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438122 ; 257718 ; 257719 ;
Abstract

An apparatus for mounting an integrated circuit chip to a main printed circuit board is disclosed. The mounting apparatus is particularly suitable for situations in which a cooling device of significant mass is used to cool the integrated circuit chip. In one embodiment, the mounting apparatus mounts the integrated circuit chip onto a daughter or sub-printed circuit (PC) board, attaches the cooling device to the integrated circuit chip, supports the cooling device (as well as the integrated circuit chip and the daughter or sub-PC board) with support members, and uses flexible conductors to electrically connect the daughter or sub-PC board to the main printed circuit board. In another embodiment, the mounting apparatus attaches the cooling device to the integrated circuit chip, supports the cooling device (as well as the integrated circuit chip) with support members, and uses a flexible connection means to electrically connect the integrated circuit chip to the printed circuit board. In either case, inertial loads, particularly those associated with the mass of the cooling device, induced by impulse forces or vibrations are shielded from damaging the connections between the integrated circuit chip and the associated printed circuit board. A method for mounting an integrated circuit is also disclosed.


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