The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 1999
Filed:
Nov. 17, 1997
Hiroji Tani, Nagaokakyo, JP;
Kazuhito Ohshita, Omihachiman, JP;
Abstract
Provided is an electroconductive paste for forming via-holes through ceramic substrates, and a method for producing ceramic substrates using the paste. The via-holes formed with the paste crack little during baking, and have high electric reliability and good solderability and platability. The paste comprises from about 80 to 93% by weight of a spherical or granular electroconductive metal powder having a grain size range of between about 0.1 and 50 .mu.m, from about 2 to 10% by weight of an insoluble resin powder having a grain size range of between about 0.1 and 50 .mu.m, and from about 5 to 18% by weight of an organic vehicle. The via-holes 2 formed through a ceramic green sheet 1 are filled with the paste 1, and a plurality of those ceramic green sheets 1 are laminated under heat and baked under a predetermined condition to produce a multi-layered ceramic substrate 6.