The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 1999
Filed:
Nov. 20, 1997
Ulrich Gosele, Halle, DE;
Abstract
A method of manufacturing microstructures in which a hollow cavity is formed in a first wafer, in particular, a silicon wafer, and the hollow cavity is, covered over by a second wafer, which is in particular, also a silicon wafer, by a wafer bonding process in vacuum for the formation of an enclosed hollow cavity, wherein the wafer bonding is carried out in an ultra-high vacuum in order to achieve the smallest possible internal pressure in the hollow cavity of less than 0.1 mbar. The surfaces of the wafers which are to be brought into contact with one another are treated by a surface cleaning process in order to produce at least substantially pure surfaces, i.e. surfaces which consist substantially only of the material of the respective wafer and which are at least substantially free of H.sub.2 O, H.sub.2 and O.sub.2. A microstructure is also claimed.