The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 1999
Filed:
Nov. 28, 1997
Seiichi Sato, Chikushino, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A chip compression-bonding apparatus includes a vertically-movable block which is vertically moved by a descending device, and has a load measurement device and a load applying device mounted thereon. A compression-bonding tool for holding a chip is provided beneath the vertically-movable block. The weight of the compression-bonding tool is supported by the load measurement device, and the compression-bonding tool is pressed against the load measurement device by the load applying device. A control portion detects a compression-bonding force of the compression-bonding tool by an amount of reduction of the value of the load measured by the load measurement device, and controls the descending device in accordance with the detected compression-bonding force.