Integrated bake and chill plate

Abstract

A method and apparatus for providing integrated bake and chill thermal cycling applied to a material substrate is provided. The apparatus is a module comprising an integrated bake and chill plate with one or more fluid channels in a generally spiraling arrangement. The fluid channels have inlets and outlets near the center and perimeter of the integrated bake and chill plate. Additionally, the fluid channels can have microchannels through portions thereof. The module can also comprise one or more thermoelectric devices, a thermally conductive plate on which the substrate directly or indirectly rests, a printed circuit board, and a variable power source. The integrated bake and chill plate, the thermally conductive plate and the thermoelectric devices are all in thermal contact with each other. The thermoelectric devices are also in electrical contact with the variable power source and comprise a top plate, a bottom plate, a support positioned between the top and bottom plates, and one or more copper pads beneath the bottom plate for establishing electrical contact. The module bakes and chills a substrate by flowing fluids of different temperatures through the generally spiraling fluid channels and adjusting the temperature of the thermoelectric devices according to a preprogrammed cycle. Different fluid flow patterns can be chosen where fluid enters near the center of the integrated bake and chill plate and drains near the perimeter, where fluid enters near the perimeter and drains near the center, or where the two patterns are combined.