The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 1999
Filed:
Feb. 27, 1998
Hiroshi Uchimura, Kokubu, JP;
Takeshi Takenoshita, Kokubu, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
A wiring board of the present invention is equipped with a laminated waveguide as a high-frequency signal transmission line. The laminated waveguide is composed of a dielectric substrate, a pair of main conductive layers laminated on the upper surface and the lower surface of the dielectric substrate, a plurality of via-holes extending in a thickness direction in the dielectric substrate so that they electrically connect the pair of the main conductive layers, and a sub-conductive layer provided in the dielectric substrate so that it is parallel to the main conductive layers and is electrically connected to the via-holes, the plurality of the via-holes form two rows extending in a signal transmitting direction with a mutual distance from each other, and in each row, the distance between adjacent via-holes is adjusted to less than 1/2 of a signal wavelength, a region surrounded with the pair of the main conductive layers and the two rows of the via-holes forms a signal transmitting region, and on both sides in the outside of the signal transmitting region, the sub-conductive layer is provided. The transmittting line by the laminated waveguide which is formed in this wiring board has especially excellent transmitting characteristics of high-frequency signals. In addition, since this wiring board can be easily produced by a laminating technology of ceramics, this wiring board also has excellent productivity.