The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 1999

Filed:

May. 30, 1997
Applicant:
Inventors:

Tohru Koyama, Hitachi, JP;

Katsuo Sugawara, Hitachi, JP;

Shoichi Maruyama, Yamatsuri, JP;

Ikushi Kano, Tokai, JP;

Yoshikiyo Kashiwamura, Hitachi, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02K / ;
U.S. Cl.
CPC ...
310 43 ; 310 42 ;
Abstract

A highly thermal-conductive and thermal-resistant electrically insulated coil with less outflow of a thermosetting resin composition can be produced, to provide a small-scale, light-weight rotating machine with high power. The thermosetting resin composition comprises (a) a polyfunctional epoxy resin containing three or more p-(2,3-epoxypropoxy) phenyl groups and a group represented by the Chemical formula 1; or an epoxy resin with a naphthalene backbone, represented by the Chemical formula 3, 4 or 5 or an epoxy resin with an anthracene backbone, such as diglycidyl ether of anthracene diol and triglycidyl ether of anthracene triol; (b) a bifunctional epoxy resin containing two p-(2,3-epoxypropoxy) phenyl groups; (c) an acid anhydride curing agent; and (d) a metal acetonate curing catalyst represented by the Chemical formula 2 at 0.1 to 5 parts by weight per 100 parts by weight of the epoxy resins.


Find Patent Forward Citations

Loading…