The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 1999
Filed:
Sep. 26, 1997
Applicant:
Inventors:
Hiroyuki Ohashi, Kamakura, JP;
Tuyoshi Kato, Mie-ken, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438692 ; 216 88 ; 216 89 ; 438693 ; 156345 ;
Abstract
The present invention provides the chemical-mechanical polishing method having the step of subjecting a film to be polished, provided on a main surface of a substrate, and having a projection portion and a recess portion on a surface thereof, to polishing and etching, wherein the projection portion of the film to be polished is mechanically polished and chemically etched while covering the recess portion with a protective film to protect it from being chemically etched by supplying a protecting agent on the film to be polished.