The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 1999
Filed:
Aug. 21, 1997
Sumitomo Chemical Co., Ltd., Osaka, JP;
Abstract
A method is disclosed for making a multi-layer up molded article. One embodiment of the invention involves (a) step of, by a shut-off pin slidably received in a resin-supplying gate open to a cavity face of a first mold, bringing the resin-supplying gate into an opening state, and supplying, by way of the resin-supplying gate, a molten thermoplastic resin between the cavity face of the first mold and a cavity face of a second mold which are in an open state; (b) step of bringing the resin-supplying gate into a closing state the shut-off pin and projecting a part of find shut-off pin from the cavity face of the first mold; (c) step of closing find first and second molds so as to attain a closed state, thereby shaping find resin, and cooling thus shaped resin so as to be solidified; (d) step of opening find first and second molds so as to be placed in the open state; (e) step of returning find shut-off pin into find first mold, thereby forming a hold in the resin solidified in find step (c) and bringing find resin-supplying gate into the opening state, and supplying a molten thermoplastic resin between the resin solidified in find step (c) and the cavity face of find second mold by way of find resin-supplying gate and find hole; (f) step of bringing find resin-supplying gate into the closing state by means of find shut-off pin; (g) closing find first and second molds so as to attain the closed state, thereby shaping find resin, and cooling thus shaped resin so as to be solidified; and (h) opening find first and second molds so as to remove it therefrom.