The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 1999

Filed:

Feb. 10, 1998
Applicant:
Inventors:

Olivier Prevotat, Buc, FR;

Jean-Andre Lhermitte, Chatenay Malabry, FR;

Assignee:

Thomson-CSF, Paris, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D / ;
U.S. Cl.
CPC ...
205125 ; 205920 ; 427 96 ; 427 97 ;
Abstract

In a method to fabricate a printed circuit having a surface plated with a base metal layer, an improvement including depositing a first metallic resist on the base layer to delimit at least patterns of circuit elements to be etched in a layer having a first thickness, forming metallized holes in the plated surface after depositing the first metallic resist; and depositing a second metallic resist after forming the metallized holes to delimit at least patterns of circuit elements to be etched in a layer having a second thickness greater than said first thickness, whereby more accurate etching in the metal layer having the first thickness compared to etching in the metal layer having the second thickness is possible.


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