The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 1999
Filed:
Feb. 23, 1998
Jan W Severin, St. Cyr au Mt.d'OR, FR;
Franciscus A Meeuwsen, Eindhoven, NL;
U.S. Philips Corporation, New York, NY (US);
Abstract
A method of selectively metallizing a thermoplastic substrate using a hot foil embossing technique, a patterned metal layer being transferred to the substrate from a metal foil by a cutting and pressing procedure including steps (a) and (b). In step (a) the patterned metal layer is first cut from the foil using a punch-press at a selected pressure p.sub.a. In step (b) the cut patterned metal layer is then attached to the substrate using a press at a pressure p.sub.b which is .ltoreq.10 N/mm.sup.2 and also <p.sub.a, and a temperature T.sub.b .gtoreq.100.degree. C. This avoids concurrent application of high pressure and high temperature, which could cause formation of upset edges at the surface of the substrate.