The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 1999
Filed:
Oct. 14, 1997
Applicant:
Inventors:
Ho Tae Jin, Cheonan, KR;
Jae Ky Roh, Cheonan, KR;
Sung Bok Hong, Cheonan, KR;
Hee Kook Choi, Cheonan, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ; B23K / ;
U.S. Cl.
CPC ...
228-62 ; 228-45 ; 228 491 ;
Abstract
An apparatus for bonding semiconductor dies to lead frame strips, each of the lead frame strips having a plurality of adjacently spaced lead frame units. The apparatus includes at least two bond units, each attaching the dies to one of the lead frame strips at a time and one die supply unit supplying the dies alternately to the bond units. The apparatus also includes at least two lead frame strip supply units, each supplying the lead frame strips to respective ones of the bond units.