The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 1999
Filed:
Jul. 30, 1998
Robert A Glowasky, Webster Grove, MO (US);
Jack H Jacobs, St. Louis, MO (US);
Bruce E McIlroy, Florissant, MO (US);
Matthew M Thomas, Madison, IL (US);
McDonnell Douglas Corporation, St. Louis, MO (US);
Abstract
A method is provided for fabricating a composite structure having an externally accessible electrical device embedded therein. At least one supporting ply is initially provided that has first and second depressions. An electrical device having at least one electrical lead is disposed in the first depression and a connector tow having at least one tube with opposed first and second ends is disposed in the second depression. The first end of the tube of the connector tow is electrically connected to the electrical lead. Thereafter, at least one additional ply is stacked on the supporting ply such that the electrical device and the connector tow are embedded. The stacked plies can then be consolidated to form an integral laminate structure. Following the consolidation, the second end of the tube of the connector tow can be accessed through the edge surface of the laminate structure to thereby define an externally accessible electrical port for receiving a corresponding connector. As such, electrical contact can be established with the embedded electrical device via the tube and the electrical lead. By establishing electrical contact with the electrical device during the fabrication process, the operation and therefore the health of the embedded electrical device can thereafter be monitored.