The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 1999
Filed:
Jul. 02, 1998
Yoshihiro Notani, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A semiconductor device includes a high-frequency semiconductor chip having first and second surfaces, and including a first high-frequency transmission line on the first surface and a first grounding conductor on the second surface; and a semiconductor package having third and fourth surfaces, and including a second grounding conductor on the third surface and a second high-frequency transmission line on the fourth surface. The high-frequency semiconductor chip is mounted on the semiconductor package so that the second surface opposes the third surface. The semiconductor device further includes first and second slots for electromagnetically coupling the first high-frequency transmission line to the second high-frequency transmission line. The first and second slots on the first and second grounding conductors, respectively, oppose each other and oppose the first and second high-frequency transmission lines.