The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 1999

Filed:

Apr. 13, 1998
Applicant:
Inventor:

Minoru Uemura, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257676 ; 257666 ;
Abstract

Supporting leads extend from one side portion of a package to another side portion thereof and are arranged on both sides of an island such that both ends of the island are supported. An electrode for a fixing potential of a semiconductor chip is connected to these supporting leads by a bonding wire. One end of these supporting lead is located outside a column of an outer lead portion as the same structure as the outer lead portion. Thus, while a structure for commonly using each of the supporting leads as a lead for a fixing potential is adopted, a thermal distribution of the semiconductor chip can be uniformed and no island is inclined at a resin seal time.


Find Patent Forward Citations

Uemura, Minoru. (1999). Horizontal package having die supports leads formed along lead column (U.S. Patent No. 5977619). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5977619

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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