The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 1999
Filed:
May. 04, 1998
Stanton James Dent, Midland, MI (US);
Edward Joseph Benson, Fremont, CA (US);
Ann Walstrom Norris, Midland, MI (US);
Yeong Joo Lee, Midland, MI (US);
Dow Corning Corporation, Midland, MI (US);
Abstract
A vacuum dispensable silicone composition comprising (A) a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) an organopolysiloxane resin consisting essentially of (a) R.sup.3.sub.2 (CH.sub.2 .dbd.CH)SiO.sub.1/2 siloxane units, (b) R.sup.3.sub.3 SiO.sub.1/2 siloxane units, and (c) SiO.sub.4/2 siloxane units wherein each R.sup.3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups free of aliphatic unsaturation, the mole ratio of the combination of (a) and (b) units to (c) units is from 0.6 to 1.1, and the resin contains 1 to 5 percent by weight of vinyl groups; (C) an organohydrogenpolysiloxane having an average of at least three silicon-bonded hydrogen atoms per molecule in an amount sufficient to provide from one to three silicon-bonded hydrogen atoms per alkenyl group in components (A) and (B) combined; (D) an adhesion promoter in an amount sufficient to effect adhesion of the composition to a substrate; (E) a hydrosilylation catalyst; (F) a platinum catalyst inhibitor having a boiling point greater than 150 .degree. C. at 0.10 MPa in an amount sufficient to retard curing of the composition at ambient temperature; wherein the composition is substantially free of air.