The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 1999
Filed:
Feb. 28, 1997
Takashi Takayanagi, Shizuoka, JP;
Fuji Photo Film Co., Ltd., Kanagawa, JP;
Abstract
A photosensitive element comprising a temporary support having thereon an aqueous resin layer which contains at least one kind of fine particles having an average particle size or agglomerated particle size of 1 to 10 .mu.m. The fine particles impart a roughened surface to the aqueous resin layer. Furthermore, a photosensitive insulating resin layer is provided on the aqueous resin layer. Also disclosed is an insulating resin image having a roughened surface which is prepared by a process comprising the steps of providing the above-described photosensitive element, laminating the photosensitive element on an insulating substrate, and pattern exposing and developing the photosensitive insulating resin layer. Also disclosed is a process for producing an multilayer printed wiring board comprising the steps of laminating the above-described photosensitive element on an insulating substrate having thereon a first wiring pattern, forming via holes in the photosensitive insulating resin layer, depositing a conductive material on the photosensitive insulating resin layer and in the via holes, and forming a second wiring pattern on the insulating resin layer which is interconnected to the first wiring pattern through the via holes.