The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 1999
Filed:
Jun. 14, 1996
Yoshihiro Nakata, Kawasaki, JP;
Shyun-ichi Fukuyama, Kawasaki, JP;
Michiko Katayama, Kawasaki, JP;
Joe Yamaguchi, Kawasaki, JP;
Hideki Harada, Kawasaki, JP;
Yoshiyuki Ohkura, Kawasaki, JP;
Fujitsu Limited, Kanagawa, JP;
Abstract
A material and a method for planarizing an uneven surface of a substrate, such as those used for making wiring boards and electronic devices and having broad patterns on their surfaces, are provided. The material is a polysilphenylenesiloxane or a copolymer of polysilphenylenesiloxane with an organosiloxane, and is applied to an uneven surface of a substrate, and then heated to be reflowed to thereby be formed into a planarized film or layer. The material allows a substrate containing wiring having a width of up to several hundred micrometers to be planarized.