The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 1999

Filed:

Nov. 24, 1997
Applicant:
Inventors:

Yasushi Kawakubo, Osaka, JP;

Shiro Ozaki, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ; B62D / ;
U.S. Cl.
CPC ...
156 78 ; 264 465 ; 264261 ; 264263 ; 2643289 ; 29450 ; 296 70 ;
Abstract

A method of fabricating an instrument panel includes providing a skin which forms a surface of the instrument panel and has side face portions extending rearwardly from a front face portion and providing a panel core having a recess for defining a molding space between the panel core and the skin. The front face portion and the side face portions define a bend angle. The recess of the panel core has peripheral walls for engaging the side face portions and the peripheral walls and a surface of the recess define a regular angle which is less than the bend angle. The bend angle, for instance, is larger than the regular angle by 2.degree. to 8.degree., and preferably by 3.degree. to 5.degree.. The panel core is placed in a first die and the skin is place in a second die such that the side face portions are deflected to fit into the recess of the panel core during mold closing. The dies are closed and a foaming material is injected between the panel core and the skin to integrate the panel core and the skin. The side face portions resiliently engage the peripheral walls to prevent leakage of the foaming material. In an embodiment of the method, a skin holding member is movably provided in the second die for holding the side face portions in position during mold closing. The skin holding member is withdrawn to permit engagement of the side face portions with the peripheral walls after mold closing.


Find Patent Forward Citations

Kawakubo, Yasushi. (1999). Method of fabricating instrument panel (U.S. Patent No. 5976289). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5976289

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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