The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 1999
Filed:
Apr. 21, 1997
Applicant:
Inventors:
Assignee:
Daido Tokyshuko Kabushiki Kaisha, Nagoya, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228 445 ; 269 43 ; 269156 ;
Abstract
A diffusion bonding method has a step of adjusting ends of material to be bonded before bonding the material after setting the materials in the diffusion bonding apparatus, whereas a diffusion bonding apparatus has a mechanism for finishing ends of materials to be bonded so that both ends face parallel to each other.