The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 1999
Filed:
Jul. 31, 1998
Eric Lee Goldner, Valencia, CA (US);
Thomas McLean, Woodland Hills, CA (US);
Amado Cordova, Woodland Hills, CA (US);
Kenneth Bean, Riverton, UT (US);
Arthur D Lang, Park City, UT (US);
Litton Systems, Inc., Woodland Hills, CA (US);
Abstract
An improved dressing for the fiber optic leads of a fiber optic gyroscope sensing coil and method for forming the same. A pair of fiber optic leads connect the sensing coil of a rotation sensing device to an integrated optics chip. The fiber optic leads are originally arranged to extend around the fiber optic sensing coil in different directions. The leads are formed of unequal lengths, where the longer of the leads is extended along an outer circumference of the sensing coil. The longer lead is bent so that the circumferential direction of longer lead reverses itself, and the longer lead then extends around the sensing coil in the same direction as the shorter lead. A low modulus adhesive is applied to the leads and cured to initially bond the leads in place against the sensing coil. The pair of leads are then wound in the same circumferential direction adjacent to each other fashion around the outer circumference of the sensing coil. After the desired amount of winding has been completed, a predetermined length of each of the leads is left available to be routed to the rotation sensing device. The entire outer surface of the wound fiber optic leads surrounding the temporary adhesion is then coated with a low modulus adhesive and cured to bond the wound leads against the sensing coil structure.