The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 1999
Filed:
Aug. 11, 1997
Applicant:
Inventors:
Takashi Kono, Tokyo, JP;
Mikio Asakura, Tokyo, JP;
Hideto Hidaka, Tokyo, JP;
Kenichi Yasuda, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438281 ; 438132 ;
Abstract
In a method of fabricating a semiconductor device, an interlayer insulating film is selectively etched to remove a level difference at an area of the interlayer insulating film on a cell plate on cylindrical capacitors and simultaneously form a concave portion on a fuse portion. Since the etching is ended to a degree that the cell plate is not exposed, the concave portion can be formed on the fuse portion not exposed. This does not add a step of forming a protection film on the fuse portion.