The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 1999

Filed:

Sep. 10, 1996
Applicant:
Inventors:

Masaharu Murakami, Ichihara, JP;

Akira Uchiyama, Ichihara, JP;

Koichi Kusakawa, Komagane, JP;

Shigeki Ichimura, Komagane, JP;

Shinobu Haga, Komagane, JP;

Assignees:

Mitsui Chemicals, Inc., Tokyo, JP;

NHK Spring Co., Ltd., Yokohama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; C08L / ; C08L / ;
U.S. Cl.
CPC ...
4283188 ; 4283197 ; 4283199 ; 521134 ; 521140 ; 525240 ;
Abstract

A foamed pad material for low-pressure compression molding which comprises a crosslinked rubbery olefinic soft resin foam and exhibits (a) a hysteresis loss of not greater than 40%, (b) a gel fraction of 20 to 98%, and (c) a density of 0.025 to 0.30 g/cm.sup.3. This foamed pad material is excellent in heat weldability with core forming materials and exhibits excellent heat resistance, strain resistance, moldability and restoring properties at the time of low-pressure compression molding at which compression and drawing are carried out at high temperatures. Moreover, the foamed pad material can allow the molded skin material to have cushioning properties with high flexibility and further to have improved feeling.


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