The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 1999
Filed:
Sep. 28, 1998
Takao Koizumi, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
An apparatus for inspecting bump junctions in a semiconductor flip chip mounting which is able to inspect a state of a junction portion, has a simple structure and is safe and suitable for mass production of semiconductor devices and a method of inspecting the same; in an apparatus for inspecting bump junction in semiconductor flip chip mounting in which a semiconductor bare chip is mounted reversely on a substrate through the bumps, the surface of the semiconductor bare chip is irradiated with a laser light and radiation heat from the heated chip is detected with an infrared camera, a computer acquires temperature distribution on the chip surface from a picture processing unit and analyzes the temperature distribution, thereby to decide the quality of the bump junction state, and decision processing is performed by acquiring data of temperature distribution from a reference semiconductor device of known excellent quality in advance by the same method and comparing with these data.