The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 1999

Filed:

Feb. 09, 1995
Applicant:
Inventors:

David Alan Bourne, Pittsburgh, PA (US);

Duane Thomas Williams, Pittsburgh, PA (US);

Kyoung Hung Kim, Pittsburgh, PA (US);

Sivaraj Sivarama Krishnan, Bangalore, IN;

Kensuke Hazama, Buena Park, CA (US);

Assignees:

Amada Company, Ltd., Kanagawa, JP;

Amada America, Inc., Buena Park, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F / ;
U.S. Cl.
CPC ...
36447407 ; 36446803 ; 72420 ;
Abstract

An intelligent sheet metal bending system is disclosed, having a cooperative generative planning system. A planning module interacts with several expert modules to develop a bending plan. The planning module utilizes a state-space search algorithm. Computerized methods are provided for selecting a robot gripper and a repo gripper, and for determining the optimal placement of such grippers as they are holding a workpiece being formed by the bending apparatus. Computerized methods are provided for selecting tooling to be used by the bending apparatus, and for determining a tooling stage layout. An operations planning method is provided which allows the bending apparatus to be set up concurrently while time-consuming calculations, such as motion planning, are performed. An additional method or system is provided for positioning tooling stages by using a backgage guide member which guides placement of a tooling stage along the die rail of the bending apparatus. A method is provided for learning motion control offset values, and for eliminating the need for superfluous sensor-based control operations once the motion control offset values are known. The planning system may be used for facilitating functions such as design and assembly system, which may perform designing, costing, scheduling and/or manufacture and assembly.


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