Method for manufacturing a chip card and chip card manufactured in

Abstract

A method for manufacturing a chip card comprising a multi-layer plastic card body; an integrated circuit arranged within a chip module; at least one coil which serves for the energy supply and/or the data exchange between the integrated circuit with external devices, with the chip module having at least two metallic contacts for an electrically conducting connection of the integrated circuit with the terminals of the coil arranged on a coil carrier layer, comprising the steps of: providing the coil carrier layer with the coil and the coil terminals being arranged on same; providing a cover layer to be applied onto the coil carrier layer on the side of the coil terminals, with the cover layer comprising recesses which correspond to the coil terminals; providing at least one thickness compensation layer to be applied onto the cover layer; stacking of the card layers in registered relationship, with the cover layer being positioned in such a manner that each of the recesses in the cover layer comes to lie in the area of the coil terminals; placing the stacked card layers into a lamination press where the card layers are combined with each other under pressure and heat whereby during lamination synthetic material compound of the coil carrier layer is pressed into the recesses of the cover layer raising the coil terminals; removal of the laminated cards from the lamination press; recess milling of a recess for accommodating the chip module in the laminated card body, whereby the raised coil terminals are exposed; and fitting the chip module into the recess of the card body and making an electrically conducting connection between the contacts of the chip module and the coil terminals.