The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 1999
Filed:
Sep. 23, 1997
Robert H Noble, Longmont, CO (US);
Hewlett Packard Company, Palo Alto, CA (US);
Abstract
A printed circuit spark gap for an overcoated printed circuit board. A metal-clad substrate is etched to form first and second printed circuit traces on the substrate. The first and second printed circuit traces define a channel having first and second ends. A layer of soldermask is deposited onto the substrate to cover a portion of the first and second printed circuit traces and to cover the channel except at an aperture. The aperture includes the spark gap. The first and second printed circuit traces and the channel are covered with a capping device. An overcoating material is applied to the printed circuit board. During the applying step, the overcoating material is allowed to infiltrate into the channel under the capping device at the first and second ends, but is not allowed to reach the aperture. Counter pressure buildup inside the channel, caused by the infiltration itself, stops the overcoating material before it reaches the intended clean area. The capping device may be removed, or may remain in the assembly. Also disclosed is an application of the inventive method for forming spark gaps having various topologies, all including the just-described channel.