The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 1999

Filed:

Sep. 20, 1996
Applicant:
Inventors:

Makoto Hori, Oogaki, JP;

Toshimi Miyamoto, Okazaki, JP;

Kenji Fukaya, Oobu, JP;

Masahiro Hamaya, Anjo, JP;

Minoru Ota, Okazaki, JP;

Naoto Miwa, Tsushima, JP;

Assignee:

Nippondenso Co., Ltd., Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B / ; H01B / ; G01N / ; G01N / ;
U.S. Cl.
CPC ...
73 2331 ; 73 3105 ; 73 2332 ; 1741281 ; 1741262 ; 204424 ;
Abstract

A lead wire for a sensor has a conductor unit including at least stainless steel wires and copper wires. By setting the cross-sectional percentage of the stainless steel wires in the conductor unit within the range of 30 to 70%, it is possible to obtain a lead wire having low electrical resistance, and high flexibility, tensile strength and elasticity. There are preferred values in hardness and heat treatment of the stainless steel wires. The copper wires are preferably coated with an antioxidant film. The lead wire may include hybrid wires stranded together and obtained by integrally molding or forming stainless steel and copper. It is preferable that the lead wire is coated with an insulating coating material such as a Teflon type resin.


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