The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 1999

Filed:

Mar. 20, 1996
Applicant:
Inventors:

Ichiro Sakamoto, Tokyo, JP;

Naoto Nakamura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
4272481 ; 118715 ; 438758 ;
Abstract

A semiconductor manufacturing apparatus including a heating device; a reaction tube disposed within the heating device, the reaction tube having a gas inlet portion and an exhaust portion parted from each other by a predetermined distance in the longitudinal direction of the reaction tube; and a plurality of gas feed pipes extending along a side wall of the reaction tube from the exhaust portion side to the gas inlet portion, the plurality of gas feed pipes being parted from each other. The reaction gas is provided through the plurality of gas feed pipes into the reaction tube, thereby providing an improved uniform temperature distribution within the reaction tube and resulting in an improved uniform film thickness of the oxide film formed on the surface of the semiconductor wafer.


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