The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 1999
Filed:
Jan. 28, 1997
Tomoo Murakami, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A wiring pattern is selectively formed on a base member by permanent resist. Furthermore, the thickness of a non-electrolytic copper plating layer is made thinner than that of a permanent resist layer on the base member, so that a concave shape is formed in combination with the permanent resist layer. A solder resist layer is formed on the non-electrolytic copper plating layer and the permanent resist layer except for a pad portion formed by the non-electrolytic copper plating layer, and a peripheral portion of the pad portion is surrounded by a wall formed by the permanent resist layer and the solder resist layer. Solder is supplied onto the pad portion surrounded by the wall by way of either the MICROPRESS method or the MICROBALL method.