The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 1999
Filed:
Aug. 01, 1995
Teiji Shimobayashi, Aichi, JP;
Tetsumi Ichioka, Aichi, JP;
Kenji Sugiyama, Aichi, JP;
Yasunobu Teramoto, Aichi, JP;
Toyoda Gosei Co., Ltd., Nishikasugai-gun, JP;
Abstract
A method of molding a hollow body to make the body nearly uniform in thickness around an internal opening thereof. A weir is provided in a central part of an opening portion of the mold cavity near an upstream side of the opening portion with respect to the direction of flow of a resin. Molten resin is injected into the cavity, and pressurized gas is thereafter injected into the molten resin in the cavity to make the internal opening in the resin. Since the weir is provided, the resin comes into uniform contact with the inner mold surface of the die at the opening portion as the resin flows into opening portion. The resin is uniformly cooled and solidified, starting with the inner surface and working inwardly, so that the hollow body is made nearly uniform in thickness around the internal opening.