The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 1999

Filed:

Nov. 07, 1994
Applicant:
Inventors:

Peter H Rose, North Conway, NH (US);

Piero Sferlazzo, Lynnfield, MA (US);

Assignee:

Krytek Corporation, Danvers, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
134-7 ; 216 58 ; 216 57 ; 1566401 ;
Abstract

In one aspect, foreign material on the surface of a substrate is processed to form a reaction product by: providing a directed flow of a fluid, comprising a reactant, to the vicinity of the foreign material to be processed; and delivering an aerosol of at least partially frozen particles continuously or intermittently to the foreign material to aid the reactant react with the foreign material to form the reaction product. In another aspect, foreign material is processed by: providing a directed flow of a fluid, comprising a reactant, to the foreign material to be processed in a limited area reaction region corresponding to a minor fraction of the total area of the substrate; agitating the foreign material in the limited area reaction region to aid the reactant react with the foreign material to form the reaction product; and providing relative motion between the substrate and the directed flow of fluid to achieve a substantially uniform exposure of the foreign material to fluid flow and the agitation. Infrared or ultraviolet radiation may also be delivered to the foreign material. Specific methods for processing oxide layers, organic layers and metal contamination are also described.


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