The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 1999
Filed:
Mar. 25, 1997
Masahiro Inohara, Tokyo, JP;
Minakshisundaran Balasubramanian Anand, Yokohama, JP;
Tadashi Matsuno, Yokohama, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
In a method of manufacturing a semiconductor device, when a copper diffusion preventing film portion on the connecting hole bottom portion is to be removed, a film thickness of other portion of the copper diffusion preventing film not to be removed is more thickly formed than that of the to-be-removed copper diffusion preventing film portion on the connecting hole bottom portion, thereby only the copper diffusion preventing film portion to be removed can be removed. The method can extend a durable length of time of a wire and can reduce a resistance of the metal wires in a connecting hole bottom portion by removing a copper diffusion preventing film on the bottom portion of the connecting hole.