The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 1999

Filed:

Oct. 28, 1996
Applicant:
Inventors:

Zoran Krivokapic, Santa Clara, CA (US);

William D Heavlin, San Francisco, CA (US);

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F / ; G06F / ;
U.S. Cl.
CPC ...
39550035 ;
Abstract

A design apparatus, article of manufacture, method and system are disclosed for simulating mass-produced semiconductor device behavior. Drain-to-source current values are obtained from actual semiconductor devices in response to voltage levels at the drain-to-source and gate of a semiconductor device. Semiconductor device attributes, such as channel-length doping concentration are also measured. A device simulator and process simulator are calibrated based upon the actual drain-to-source current values and measured attributes. A process simulator is run in response to simulated process parameters to obtain a plurality of simulated mass-produced semiconductor devices having varying semiconductor attributes. A device simulator is then run using the plurality of simulated mass-produced devices to obtain a plurality of I/V curves based upon the plurality of simulated semiconductor devices. Worst-case I/V curves are then obtained from the plurality of I/V curves by analyzing drain-to-current values in the plurality of I/V curves associated with a predetermined voltage value. Parameters then may be extracted from the worst-case I/V curves in order to determine accurate worst-case semiconductor device designs. Manufacturing guard bands may then also be identified based upon the worst-case I/V curves and idealized I/V curves.


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