The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 1999
Filed:
Mar. 26, 1997
Akihiro Yano, Tokyo, JP;
Yuji Kondo, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A method of mounting a semiconductor device first forms a barrier layer on one surface of an semiconductor substrate made of Si. Then, a first Au layer is formed on the barrier layer. Accordingly, a semiconductor device is provided. The barrier layer is formed of metal for preventing mutual diffusion of Si in the Si semiconductor substrate with Au in the first Au layer at a high temperature of 600.degree. C. or higher. A step of acquiring a package substrate forms a metal coated layer on a base first and then forms a second Au layer on the surface of the metal coated layer. Then, the semiconductor device is placed on the package substrate with the first and second Au layers contacting with each other, and the semiconductor device and the package substrate are scrubbed against each other. Consequently, the first and second Au layers form Au--Au eutectic layer, thereby connect the semiconductor device to the package substrate.