The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 1999
Filed:
Feb. 12, 1998
Sailesh Chittipeddi, Allentown, PA (US);
William T Cochran, Clermont, FL (US);
Yehuda Smooha, Allentown, PA (US);
Lucent Technologies Inc., Murray Hill, NJ (US);
Abstract
The present invention provides, in one embodiment, an integrated circuit having a substrate and active devices formed on the surface of the substrate. Other embodiments of the integrated circuit provide for having at least either three or four metal layers. In a particular embodiment of the present invention, the integrated circuit comprises a bond pad formed over a portion of the active devices. The bond pad has a footprint. As used therein the word footprint means the area covered by the device to which the word refers. The integrated circuit further incudes a patterned metal layer having a metal layer footprint that is located between the bond pad and the substrate and a built-in self-test (BIST) circuit that has a BIST footprint, which is located between the substrate and the bond pad. In this particular embodiment, the bond pad footprint overlays at least a portion of the metal layer footprint and the BIST footprint. However, in a more advantageous embodiment, the bond pad footprint overlays a substantial portion of the metal layer footprint and the BIST footprint.