The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 1999

Filed:

Aug. 26, 1992
Applicant:
Inventors:

Steven S Lee, Colorado Springs, CO (US);

Gayle W Miller, Colorado Springs, CO (US);

Assignee:

Hyundai Electronics America, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438601 ; 438132 ;
Abstract

A fusible link and method for its fabrication. A polysilicon pad is formed on top of an insulating layer and covered with a second insulating layer. A trench is selectively etched into the second insulating layer exposing the top of the polysilicon pad. An fusible aluminum link is then formed over the second insulating layer and trench and conformal therewith. When a programming current is driven through the link, the aluminum melts and is absorbed by the polysilicon pad, thereby preventing the link's growback.


Find Patent Forward Citations

Lee, Steven. (1999). Method of fabrication of semiconductor fuse with polysilicon plate (U.S. Patent No. 5963825). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5963825

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…