The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 1999
Filed:
Aug. 20, 1997
Applicant:
Inventor:
Philip H Chen, Angleton, TX (US);
Assignee:
Sulzer Intermedics Inc., Angleton, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H05K / ;
U.S. Cl.
CPC ...
361764 ; 361761 ; 361783 ; 257686 ; 257723 ; 257777 ; 257787 ; 438126 ; 600374 ;
Abstract
A printed circuit board substrate includes cavities in which electronic components, such as integrated circuits, are mounted and encapsulated. Once the electronic components are encapsulated, other electronic components can be mounted above the encapsulated component on the top surface of the substrate, thereby increasing the number of components that can be mounted to a circuit board of a given area. The encapsulated components are mounted using any one of a variety of techniques. The substrate may include multiple conductive layers for electrically interconnecting the encapsulated components to other components.