The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 1999

Filed:

Oct. 03, 1996
Applicant:
Inventors:

Akira Yokoi, Tsurugashima, JP;

Satoshi Miyaguchi, Tsurugashima, JP;

Kenichi Nagayama, Tsurugashima, JP;

Hirofumi Kubota, Tsurugashima, JP;

Kenji Yoshida, Tsurugashima, JP;

Taizo Ishida, Tsurugashima, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
M01J / ;
U.S. Cl.
CPC ...
313506 ; 313505 ; 313509 ; 313512 ;
Abstract

A method for manufacturing an organic EL display panel includes; forming first display electrodes corresponding to emitting portions and bonding pads arranged at a periphery of an image-region as a patterning step; forming electrically insulative ramparts for exposing at least portions of the first display electrodes and protruding from the substrate as a rampart formation step, the each electrically insulative rampart having an overhanging portion projecting in a direction parallel to the substrate preferably at an upper and further having extensions each extending between the adjacent bonding pads to isolate the adjacent bonding pads each other and define a bonding-region between the adjacent extensions on each the bonding pad; depositing organic electroluminescent media onto exposed portions of the first display electrodes respectively, thereby forming organic function layers each including at least one organic electroluminescent medium on the first display electrodes; and forming second display electrodes on the organic function layers and the bonding-regions of the bonding pads so as to electrically connect to the bonding pads.


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