The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 1999
Filed:
Jan. 07, 1997
Applicant:
Inventors:
Shoji Yamamoto, Osaka, JP;
Kazuhiko Yamamoto, Osaka, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428 401 ; 283 81 ; 428 413 ; 428 415 ; 428 417 ; 428 418 ; 428 422 ; 428 423 ; 428516 ;
Abstract
A protective member for a semiconductor wafer wherein a pressure-sensitive adhesive layer formed on a protective film is temporarily adhered to a separator comprising a reinforcing layer and a cover layer, through the cover layer. The separator of the protective member does not require a surface treatment with a release agent and in processing a semiconductor wafer, such as back-surface grinding, the protective film can be automatically peeled and is adhered to the semiconductor wafer via an automatic adhering apparatus to enable the desired processing.