The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 1999
Filed:
Jun. 01, 1995
Applicant:
Inventors:
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
21912165 ; 21912168 ; 21912169 ; 21912183 ; 264166 ;
Abstract
A dry process to remove mold flash on integrated circuit packages (IC packages) by using pulse, short wavelength laser irradiation. The mold remnants on the surface or in holes of the lead frame can be removed by pulse laser irradiation, with the effect of thermal expansion of lead frame metals and momentum transferring from the laser beam to the mold remnants. Compared with conventional water jet or etching processes, the new technique has high productivity and does not degrade the reliability of the IC packages, due to the fact that there is no water or chemical solutions involved in the process.