The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 1999

Filed:

Mar. 14, 1996
Applicant:
Inventors:

Yoshiaki Satou, Tokuyama, JP;

Tadamitsu Kanekiyo, Kudamatsu, JP;

katsuyoshi Kudo, Kudamatsu, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05H / ;
U.S. Cl.
CPC ...
216 67 ; 216 68 ; 216 70 ; 216 71 ; 438710 ; 438728 ; 438729 ; 427569 ; 427571 ; 427575 ; 156345 ; 1187 / ; 1187 / ; 1187 / ; 118724 ;
Abstract

A plasma processing apparatus and method controls the temperature of those portions in the processing chamber to which reaction products or gaseous reaction products generated during plasma processing adhere, thereby minimizing the generation of foreign matter and ensuring high yields. A plasma processing gas is supplied to the plasma generation chamber 10 whose pressure is maintained at a predetermined value. Provided in the plasma generation chamber are a specimen mount 11 on which to mount an object to be processed and an evacuation mechanism 16 that evacuates the plasma generation chamber. The inner sidewall portion of the plasma generation chamber is provided with a temperature controller 34, which heats the inner side wall portion of the processing chamber above the specimen to a temperature at which reaction products sublimate, and a further temperature controller 35 is provided to cool the lower part of the specimen mount, the inner bottom portion of the processing chamber and the chamber exhaust pipe to a temperature at which the reaction products solidify.


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