The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 1999
Filed:
Apr. 17, 1998
Eng-Pi Chang, Arcadia, CA (US);
Yao-Feng Wang, Diamond Bar, CA (US);
Avery Dennison Corporation, Pasadena, CA (US);
Abstract
This invention relates to a method for selecting a substrate intended for use in a cutting operation. The method is particularly suitable for selecting facestock materials intended for use in making pressure-sensitive adhesive (PSA) constructions such as PSA labels. The method includes the following steps (A)-(D). Step (A) involves cutting the substrate during a first cutting step to form at least two shapes in the substrate. The shapes are positioned in spaced relationship to each other. A matrix is formed during this cutting step. The matrix is the waste substrate material around the shapes. Step (B) involves cutting the substrate with a second cutting step to form a test sample. The test sample is comprised of part of one shape, part of the next adjacent shape, and the matrix around the shape parts. Step (C) involves separating the matrix from the shape parts while measuring the force required to separate the matrix from the shape parts and measuring the displacement of the separating force. Step (D) involves determining the friction energy required to separate the matrix from the shape parts. The selection of the substrate is dependent on the friction energy.