The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 1999

Filed:

Apr. 07, 1997
Applicant:
Inventors:

Norito Umehara, Oita, JP;

Masazumi Amagai, Beppu, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
438118 ; 438464 ; 438460 ; 438928 ; 438976 ;
Abstract

Our semiconductor device is an IC chip 10 whose back surface is affixed to a mounting section 81 by means of a thermoplastic adhesive (for example, thermoplastic polyimide) 84. Package cracks are eliminated or markedly reduced and the problems with productivity for mounting curing and mounting alleviated. Even when a padless special lead frame or one with a small die pad is used, package cracks are eliminated or markedly reduced, and the lead frame can be mounted easily and with good reliability on top of the lead frame.


Find Patent Forward Citations

Umehara, Norito. (1999). Semiconductor device, its manufacturing method, and dicing adhesive (U.S. Patent No. 5960260). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5960260

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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