The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 1999

Filed:

May. 14, 1998
Applicant:
Inventors:

Scott E Leonard, Rockwall, TX (US);

Yi Teh Shih, Richardson, TX (US);

William L Woods, Jr, Kaufman, TX (US);

Assignee:

Lucent Technologies Inc., Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ;
U.S. Cl.
CPC ...
361752 ; 361736 ; 361747 ; 361757 ; 361767 ; 361771 ; 361813 ; 174 522 ; 26427211 ;
Abstract

A surface mount package for containing a board-mounted power supply, a method of manufacturing the same and a board-mounted power supply employing the package. In one embodiment, the package includes: (1) a plurality of leads having first ends and second, surface mount ends, (2) a dielectric lead frame that retains the plurality of leads in predetermined positions relative to one another such that at least some of the second, surface mount ends are co-planar, the first ends couplable to the board-mounted power supply, (3) a shell, coupled to the lead frame, that forms a portion of a periphery of the surface mount package and (4) potting material located between the lead frame and the shell.


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