The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 1999
Filed:
Aug. 09, 1993
Shigeyuki Sasaki, Ibaraki-ken, JP;
Tadakatsu Nakajima, Ibaraki-ken, JP;
Noriyuki Ashiwake, Tsuchiura, JP;
Yasuo Ohsone, Tsuchiura, JP;
Toshio Hatada, Tsuchiura, JP;
Toshiki Iino, Ibaraki-ken, JP;
Akio Idei, Hadano, JP;
Kenichi Kasai, Hadano, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.