The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 1999
Filed:
May. 29, 1997
Applicant:
Inventors:
Haruhiko Furukawa, Chiba, JP;
Yoshitsugu Morita, Chiba, JP;
Toshio Saruyama, Chiba, JP;
Makoto Yoshitake, Chiba, JP;
Assignee:
Dow Corning Toray Silicone Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
525209 ; 525116 ; 525169 ;
Abstract
A thermosetting resin composition, comprising: a thermosetting organic resin (A), and an organopolysiloxane (B) represented by the following average unit formula: R.sub.a SiO.sub.(4-a)/2 wherein R is a selected from the group consisting of substituted or unsubstituted monovalent hydrocarbon groups, acryl-containing organic groups, methacryl-containing organic groups, and an alkoxy groups. The curable compositions of the invention exhibit excellent mold release characteristics and can be utilized to produce articles having water-repellent characteristics.